There are rumors about the next flagship processor, the Qualcomm Snapdragon 8 Elite Gen 6. So, the company could use cooling technology from its main rival Samsung.
Previously, it was reported that Samsung was providing its cooling technology to third-party companies.
We are talking about a solution called Heat Pass Block (HPB). This is basically a special heatsink that is installed above the processor and helps it dissipate heat more effectively, media writes. Currently, this technology is used in Samsung Exynos 2600.
However, so far this is only unconfirmed data. Even if this is true, it's unclear whether Qualcomm will have time to integrate someone else's solution into its new chip.
