Intel's US manufacturing capacity exceeds that of TSMC. Intel's Fab 52 facility in Arizona is capable of producing more wafers per month than either TSMC Fab 21 module and is designed for more advanced process technology.
The Intel factory is designed to produce chips using 18A technology (1.8 nm type). It uses RibbonFET (GAA) transistors and PowerVia system. The factory's design capacity is 40,000 wafers/month.
Fab 52 currently has four ASML Twinscan NXE Low-NA EUV lithography systems, including at least one NXE:3800E, capable of processing up to 220 wafers per hour. There are also three NXE:3600D systems.
Compared to the TSMC factory operating on N4/N5 process technology, the Intel factory can produce chips with double the output. However, Fab 52 is expected to be fully loaded only in 2027, when the output of usable chips based on 18A technology reaches the planned level.
